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Design acc. to |
OBSAI System Spezifikation V 1.1 |
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Number of contacts |
up to 4 |
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Contact spacing |
3.00 mm |
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Clearance and creepage |
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distances between contacts |
> 2.3 mm |
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Working current |
23 A max. (OBSAI configuration) |
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20 A max. (fully loaded with power contacts) |
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Test voltage U r.m.s. |
AC 1500 V min. |
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Contact resistance |
< 1 mΩ |
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Insulation resistance |
> 10 GΩ |
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Temperature range |
- 55 °C ... + 125 °C |
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Reflow temperature |
220 °C for 2 minutes, 260 °C max. short-term |
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Durability as per |
Performance level 2 = 250 mating cycles in total. |
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IEC 61 076–4–101 |
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First 125 mating cycles, then 4 days gas test using 0.5 ppm SO2 and 0.1 ppm H2S (at 25 + 2 °C and 75 + 3 % humidity). Measurement of contact resistance. | |
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The remaining 125 mating cycles are subject to measurement of contact resistance and visual inspection. No abrasion of the contact finish through to the base material. No functional impairment. |
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Termination technique |
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Male connectors |
Press-in or solder termination, suitable for (lead-free) pin-in-hole reflow soldering |
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Female connectors |
Press-in terminantion |
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Mating force |
max. 4 N / contact |
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Withdrawal force |
min. 0.5 N / contact |
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Materials |
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Mouldings |
Thermoplastic resin, glass-fibre filled, UL 94-VO |
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Contacts |
Copper alloy |
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Contact surface |
Selectively gold plated (contact zone) |
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Contact styles |
Standard, leading, lagging |
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Packeging |
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Tube |
Male and female connectors |
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Tape & Real |
On request for male solder connectors |
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