har-pak® connector system

General informations

Future packaging systems for electronic equipment must be able to accomodate highly integrated components and be compatible with modern pcb assembly procedures.

har-pak® connectors1) are an integral part of the electrical and mechanical construction of such systems.

This new development is designed in a three dimensional modular format. Due to CAE / CIM, a flexible and cost effective system is offered to the user, from design stage through to production. All existing and projected future packaging requirements are met by har-pak®.

Typical requirements of such a connector system are as follow:

● High contact density

● Modular construction designed for state of the art backplane wiring techniques

● Solderless termination techniques

With har-pak®, an optimum utilisation of space is achieved with no loss of contact pitch when components are joined together. The minimum daughtercard pitch is only 15 mm.

The construction of har-pak® considers the possibility of combinations with other standardised packaging systems and meets all technical requirements of data communication, medical and process control markets.

har-pak® connectors are available in sizes 1 SU, 2 SU, 2.3 SU, 4 SU, 5.4 SU, 9 SU and 10 SU according to IEC 61 076-4-100 (SU = System Unit = 25 mm).

The 5 row arrangement with the 10 SU version carries up to 475 contacts in one connector module. Customised designs of this indirect, inverse connector system are available on request.

Male and female connectors accomodate coaxial, high current, first mate contacts and are designed in solderless press-in technique. An optimum screening concept for protection against Electromagnetic Interference (EMI) is achieved by pseudo coaxial contact arrangements.

Male and female connectors offer the following benefits:

Male connectors

● Precision contacts, including the interface system

● Reliable press-in technology for multilayer pcb’s (up to 6.00 mm)2)

● Preleading / lagging contacts possible in all positions

● Contact plating for all performance levels

● Press-in contact header with compliant press-in zone

Female connectors

● Two contact points

● Contacts protected by moulding

● Different contact loadings possible

● Integrated fixing elements

● Press-in contact with compliant press-in zone
 

1) specified acc. to IEC 61 076-4-100 (DIN 41 642, CECC 75 101-807 and others)
2) The maximal allowed board thickness depends on several parameters. For boards with more than 4.5 mm please contact us.